To achieve superior product performance, Fan-Out Panel-Level Packaging (FOPLP) technology has become a key to realizing higher-density and higher-performance chip packaging. Through multi-layer Redistribution Layers (RDLs), FOPLP achieves thinner package thickness and superior electrical performance. However, this technology also significantly increases the requirements for circuit precision and the difficulty of inspection.

Features:
✔ Eliminates interference from non-current layer circuit patterns; effectively detects defects in the current layer circuits
✔ Compatible with 4-layer RDL fine line L/S=2µm circuit products
✔ Die to Die & Die to CAD