With the increasing volume of information transmission, in order to meet the high-density connection requirements of chips and further reduce power consumption, glass substrates may be used in wafer packaging for heterogeneous integration in the future. However, the TGV process has extremely high requirements for various aspects of the glass vias after drilling, and due to the optical characteristics of the glass substrate, general AOI inspection methods are difficult to perform effective measurements.

FAVITE’s glass substrate TGV inspection and metrology machine integrates advanced optical inspection technology, a precision mechanical platform, and AI intelligent algorithms, enabling comprehensive inspection and 2D/3D measurement of both sides of the glass substrate in a single scan.

Features:
✔ Compatible substrate sizes: 510*515mm~620*750mm
✔ Compatible glass thicknesses: 0.3~1.1mm
✔ Front and back side inspection/measurement can be completed without flipping
✔ Real-time image capture during inspection and 2D measurement
✔ Supports glass surface, edge, and laser drilling inspection
✔ Combines traditional algorithms / CAD commands (CAD base) / AI real-time inspection
✔ 2D measurements: hole diameter / hole position / concentricity / circularity / tilt angle
✔ 3D optical measurement solutions