As IC substrate line density continues to increase, and linewidth and spacing continue to shrink, traditional inspection methods are no longer effective in detecting defects such as opens, shorts, and dents. Especially in the SAP/mSAP process before flash etching, minute defects in the electroplated copper lines are more easily overlooked.

FAVITE provides the best inspection solutions and equipment for electroplated copper lines before flash etching in the SAP/mSAP process, effectively improving the product yield of IC substrates and reducing production costs.

Features:
✔ Real-time AI inspection
✔ Open/Short/Dent defect detection
✔ Effectively avoids false defects caused by copper particles/color variations/foreign material
✔ Provides electroplated copper lines before flash etching in the SAP/mSAP process
✔ Best inspection solution