- AI Real-time Inspection: High-speed capture to achieve capture, inspection, and classification in the same time.
- Automatic line width/aperture measurement.
-
Features -
Features
- High-speed inspection + AI auto defect classification
- Inspection items : Display area and Open/Short in peripheral Fan-Out area line, foreign material, contamination, scratch.
- Supporting different sizes of Substrate or Panel according to customer needs.
-
Features
- AI Real-time inspection.
- Inspection items：Die defect, Damage, Contamination, Scratch, Die Missing.
- Die shift/rotate after COW or COC.
- Supporting 4"-8" wafers or different sizes of panels according to customer needs.
-
Features
- AI Real-time Inspection：inspection operation speed can reach more than 50 FPS.
- Inspection Items： Cu pad defect, Sfift, LED Bonding abnormal(Die Location Shift & Rotation).
- Supporting different sizes of Substrate or Panel according to customer needs.
-
Features
- Foreign Material, Cracking, Broken, Contamination.
- The size of cover glass: Diameter up to 300mm
- AI Real-time Inspection：
- Capture, inspect, and Classify simultaniously.
-
Features
- Foreign Material, Fiber, Poor Etching, Organic Residue.
- CMM Mask：8" / 12"
- Supports measurement of surface flatness, opening size and Frame height.
- AI real-time inspection: capture, inspect, and classify simultaniously.
-
Features
- Foreign Material, PR Residue, Film Broke.
- Wafer Size: Diameter up to 300mm.
- AI AOI: Capturing, inspecting, and Classifying simultaneously.
