Wafer-level 2.5D Advanced Packaging/Chiplet Integration High-Precision Die Shift Metrology Tool
Wafer-level 2.5D Advanced Packaging/Chiplet Integration High-Precision Die Shift Metrology Tool
✔Applied for wafer level 2.5D advanced package
✔Support multi-die face up & face down placement
✔Die shift/rotation feedback for pick & place/die bonding accuracy
✔Die shift/rotation metrology after molding
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