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Panel-level 2.5D Advanced Packaging/Chiplet Integration High-Precision Die Shift Metrology Tool

Panel-level 2.5D Advanced Packaging/Chiplet Integration High-Precision Die Shift Metrology Tool

Panel-level 2.5D Advanced Packaging/Chiplet Integration High-Precision Die Shift Metrology Tool

✔ Applied for panel level 2.5D advanced package
✔ Support multi-die face up & face down placement
✔ Die shift/rotation feedback for pick & place/die bonding accuracy
✔ Die shift/rotation metrology after molding

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