Fan-Out Panel-Level Packaging (FOPLP) technology enables higher utilization through panel packaging, further reducing packaging costs. Similar to FOWLP, FOPLP has extremely high precision requirements for chip placement alignment. Inaccurate alignment can lead to short circuits or open circuits, significantly impacting product performance.

FAVITE’s FOPLP Die Location measurement machine can complete chip offset/rotation measurements in a short time, improving production efficiency.

Features:
✔ Employs FAVITE’s unique AI real-time measurement and inspection solution.
✔ Chip position offset/rotation measurement after chip replacement.
✔ Simultaneous detection of bumping damage and die chipping.