Fan-Out Wafer-Level Packaging (FOWLP) has become a key technology for achieving higher density and performance chip packaging. It has extremely high precision requirements for chip placement alignment. If the alignment is inaccurate, it may cause short circuits or open circuits, which will have a significant impact on product performance.

FAVITE’s FOWLP Die Location measurement machine can complete chip offset/rotation measurements in a short time, improving production efficiency.

Features:
✔ Employs FAVITE’s unique AI real-time measurement and inspection solution.
✔ Compatible with 8″/12″ Wafer/Frame forms.
✔ Chip position offset/rotation measurement after chip replacement.
✔ Simultaneous detection of bumping damage and die chipping.