✔ Main Defect Types: Foreign Material, PR Residue, Film breakage
✔ Micro OLED Wafer Compatibility: 12-inch Si-wafer
✔ Applicable Processes:
1. TFE encapsulation (nitrogen environment) inline inspection
2. Post-encapsulation TFE/CF offline inspection
3. Cover glass lamination inspection after wafer encapsulation
✔ AI-powered real-time defect classification
✔ Minimum Defect Size: 0.6μm