Micro OLED TFE & CF AOI
✔ Main Defect Types: Foreign Material, PR Residue, Film breakage
✔ Micro OLED Wafer Compatibility: 12-inch Si-wafer
✔ Applicable Processes:
1. TFE encapsulation (nitrogen environment) inline inspection
2. Post-encapsulation TFE/CF offline inspection
3. Cover glass lamination inspection after wafer encapsulation
✔ AI-powered real-time defect classification
✔ Minimum Defect Size: 0.6μm
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Micro OLED TFE & After CF
Features
Due to the physical limitations of the OLED organic light-emitting structure, OLEDs require a Thin Film Encapsulation (TFE) process to prevent the intrusion of ambient moisture and oxygen, thereby extending the lifespan of the OLED panel.
FAVITE has combined TFE inspection with CF inspection and launched the Micro OLED TFE & CF Defect Inspection Machine to perform rigorous TFE and CF defect detection on customer products, ensuring product quality and yield.
Features:
✔ Main Defect Types: Foreign Material, PR Residue, Film breakage
✔ Micro OLED Wafer Compatibility: 12-inch Si-wafer
✔ Applicable Processes:
1. TFE encapsulation (nitrogen environment) inline inspection
2. Post-encapsulation TFE/CF offline inspection
3. Cover glass lamination inspection after wafer encapsulation
✔ AI-powered real-time defect classification
✔ Minimum Defect Size: 0.6μm
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