✔ A new generation model with 1.5x faster speed
✔ Supports inspection of various die defects and missing dies before and after giant rotation
✔ Minimum defect inspection accuracy: 1μm
✔ Simultaneously performs high-precision die offset/rotation measurement with a repeatability of up to 0.7μm
✔ Equipped with AI RTDC and AI ADJ, effectively distinguishing between valid defects, invalid defects, and defect types, improving detection efficiency